Warpage Analysis of The IC Package - PQFP
碩士 === 國立中山大學 === 機械工程學系 === 87 === A study has been performed to determine the equation of a 100 leads PQFP package warpage interrelated to material properties. Taguchi method and three-dimensional finite element methods are used to find the most influencing factors which can cause package warpage....
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43922645080884092521 |