銀厚膜表面蒸鍍銦、錫後之固液擴散接合實驗

碩士 === 國立中央大學 === 機械工程研究所 === 87 === Abstract Solid-liquid interdiffusion (SLID) bonding between silver and indium, and silver and tin has been investigated in this study to develop heat-resistant microjoints for thick-film conductors. Silver conductive thick film (8μm in thickness)...

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Bibliographic Details
Main Authors: Long-wei Huang, 黃隆瑋
Other Authors: Jing-chie Lin
Format: Others
Language:zh-TW
Published: 1999
Online Access:http://ndltd.ncl.edu.tw/handle/22847897961900456370