銀厚膜表面蒸鍍銦、錫後之固液擴散接合實驗
碩士 === 國立中央大學 === 機械工程研究所 === 87 === Abstract Solid-liquid interdiffusion (SLID) bonding between silver and indium, and silver and tin has been investigated in this study to develop heat-resistant microjoints for thick-film conductors. Silver conductive thick film (8μm in thickness)...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22847897961900456370 |