The Study of Fiber-Solder-Ferrule and Substrate-Submount Package in Temperature Cycling
碩士 === 國立交通大學 === 光電工程研究所 === 87 === In this study ,we presented the measurement of the fiber shift and the intermetallic compound (IMC) growth under temperature cycling test. The thermally induced fiber shifts under a temperature cycling test of an optical fiber soldered into a ferrule packaging...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66023613991717940809 |