Fabrication of High Aspect Ratio Copper Interconnect Using Thick-film Photoresist Process
碩士 === 國立交通大學 === 材料科學與工程系 === 87 === In this work, we formed vias in thick-film photoresist and filled the vias by pulse electroplating process to fabricate the copper(Cu) interconnect with high aspect ratio. The deposition of thick film photoresist, conditions of lithography and pulse electroplati...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43217202546488731709 |