The Taguchi Analysis of Mold Flow Simulation of IC Packaging
碩士 === 國立成功大學 === 機械工程學系 === 87 === The object of this study is to improve the numerical simulation method to reproduce the mold flow stage of microchip encapsulation by C-MOLD. For traditional microchip encapsulation modeling method in C-MOLD, part runners and connectors are often used to simulate...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/90155280482311341805 |