Study of Heat Transfer for Heat Sinks with Impingement Flow
碩士 === 國立成功大學 === 航空太空工程學系 === 87 === The recent development in VLSI and other electronic technology has made heat dissipation from electronic components grow more rapidly than ever. Take CPU for example, the heat flux from CPU surface has almost reached 10 % the level of that from the sun....
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| Format: | Others |
| Language: | zh-TW |
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1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/04022841053729424241 |