The Influence of Electroplating Parameters on Solder Bump Uniformity and The Reliability Investigations
碩士 === 國立成功大學 === 材料科學及工程學系 === 87 === This research investigated the manufacturing and properties of the Si/Ti/Cu/Ni-P/63Sn-37Pb solder bump. Ti/Cu/Ni-P was applied as the under bump metallurgy (UBM). The Ti/Cu thin film was sputtering deposited on the 4 inch silicon wafer。 The Cu thin flim (0.8 μ...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22889911623243781899 |