A Reliability Analysis of the Flip Chip Joint under Cyclic Thermomechanical Loading
碩士 === 國立成功大學 === 工程科學系 === 87 === Abstract The present paper focuses on the application of nonlinear finite element analysis (FEA) via ANSYS to study the reliability of the flip chip solder joint under thermal-cyclic loading. Different material models used to simulate the 63/37 SnPb sol...
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| Format: | Others |
| Language: | en_US |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49992843489575166404 |