Thermal Stress Analysis of the Electronic Packaging

碩士 === 國立成功大學 === 土木工程學系 === 87 === The trend in the development of new electronic packages is high performance and high reliability. In this thesis, a nonlinear finite element framework was established for processing mechanics molding of IC packaging. A parametric study is performed usin...

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Main Authors:	Fuhsing Wang, 王復性
Other Authors:	Tungyang Chen
Format:	Others
Language:	zh-TW
Published:	1999
Online Access:	http://ndltd.ncl.edu.tw/handle/22466306793917596351

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spelling	ndltd-TW-087NCKU00150282015-10-13T17:54:33Z http://ndltd.ncl.edu.tw/handle/22466306793917596351 Thermal Stress Analysis of the Electronic Packaging 電子構裝元件的熱應力分析 Fuhsing Wang 王復性碩士國立成功大學土木工程學系 87 The trend in the development of new electronic packages is high performance and high reliability. In this thesis, a nonlinear finite element framework was established for processing mechanics molding of IC packaging. A parametric study is performed using linear elastic and viscoelastic properties for the encapsulant material.Solder joints in electronic packages operate at temperatures that are high homologous temperatures for solder material.One of these models is the Viscoplasticity Theory Based on Overstress(VBO). Tungyang Chen 陳東陽 1999 學位論文 ; thesis 156 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立成功大學 === 土木工程學系 === 87 === The trend in the development of new electronic packages is high performance and high reliability. In this thesis, a nonlinear finite element framework was established for processing mechanics molding of IC packaging. A parametric study is performed using linear elastic and viscoelastic properties for the encapsulant material.Solder joints in electronic packages operate at temperatures that are high homologous temperatures for solder material.One of these models is the Viscoplasticity Theory Based on Overstress(VBO).
author2	Tungyang Chen
author_facet	Tungyang Chen Fuhsing Wang 王復性
author	Fuhsing Wang 王復性
spellingShingle	Fuhsing Wang 王復性 Thermal Stress Analysis of the Electronic Packaging
author_sort	Fuhsing Wang
title	Thermal Stress Analysis of the Electronic Packaging
title_short	Thermal Stress Analysis of the Electronic Packaging
title_full	Thermal Stress Analysis of the Electronic Packaging
title_fullStr	Thermal Stress Analysis of the Electronic Packaging
title_full_unstemmed	Thermal Stress Analysis of the Electronic Packaging
title_sort	thermal stress analysis of the electronic packaging
publishDate	1999
url	http://ndltd.ncl.edu.tw/handle/22466306793917596351
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Thermal Stress Analysis of the Electronic Packaging

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