Thermal Stress Analysis of the Electronic Packaging
碩士 === 國立成功大學 === 土木工程學系 === 87 === The trend in the development of new electronic packages is high performance and high reliability. In this thesis, a nonlinear finite element framework was established for processing mechanics molding of IC packaging. A parametric study is performed usin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22466306793917596351 |