Polysiloxane Modified Epoxy
碩士 === 義守大學 === 材料科學與工程學系 === 87 === Encapsulation is one of the important steps in IC packaging processes. The yield is highly affected by the residual stress in the packages, which results from the chemical shrinkage due to crosslinking and physical shrinkage during cooling. In this work, a low...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25731625923277916931 |