| Summary: | 碩士 === 中原大學 === 機械工程學系 === 87 === Current IC warpage analytical models researches base mainly on Dr. Suhir’s theory of the compatibility conditions for the interfacial strains. The analytical model in Dr. Suhir’s theory is constructed upon four layers of two-dimensional materials. There are two sections in the model: one is the section comprising the silicon chip and one is the section without the silicon chip. The latter section is only roughly simulated with a single homogenous material and is unable to correctly simulate the geometric shape of an actual encapsulation component. This thesis, extends Dr. Suhir’s analytical model to possessing unlimited layers and consisting of many sections, thus not only increases the completeness and correctness of the analysis results but also resolves the problem of accommodating models with different geometric shapes.
In addition, the geometrical influence, such as down-set and thickness ratio, are studied to find smaller warpage. At last, CAE software is used to study the whole encapsulation process. The final result is verifie
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