The analysis and Research for The warpage of IC Packaging
碩士 === 中原大學 === 機械工程學系 === 87 === Current IC warpage analytical models researches base mainly on Dr. Suhir’s theory of the compatibility conditions for the interfacial strains. The analytical model in Dr. Suhir’s theory is constructed upon four layers of two-dimensional materials. There are two se...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71652737335610921782 |