Thermal and Thermal Stresses Analysis in Electronic Package
碩士 === 國立雲林科技大學 === 機械工程技術研究所 === 86 === The research describes how Finite Element Method(FEM) is used to simulate the temperature distribution of the electronic package under various environment condition. The thermal stresses due to material mismatch between different components of the package are...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/84880142711789735638 |