Analysis of heat transfer for packaged IC
碩士 === 東海大學 === 化學工程學系研究所 === 86 === The main purpose of this research is to develop a heat transfer program for packaged IC by using the finite differencenumerical analysis method. The simulated IC is epoxy packaged with copper(Cu) and aluminum(Al) lead frame and 16,20,28 and 40 pi...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/99450964597976320794 |