Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers

碩士 === 國立海洋大學 === 電機工程學系 === 86 === In this thesis, we present two kind layers, passivation and carrier confinement layers of HBT. First, we report on the fabrications and characterizations of the InGaP/GaAs d-doped single heterojun...

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Main Authors: Hsieh, Jin-Lung, 謝金龍
Other Authors: Lour Wen-Shiung
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/70126026537602767254
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spelling ndltd-TW-086NTOU14420102016-06-29T04:13:35Z http://ndltd.ncl.edu.tw/handle/70126026537602767254 Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers 載子侷限層與保護層於最小化異質接面雙極性電晶體之研究 Hsieh, Jin-Lung 謝金龍 碩士 國立海洋大學 電機工程學系 86 In this thesis, we present two kind layers, passivation and carrier confinement layers of HBT. First, we report on the fabrications and characterizations of the InGaP/GaAs d-doped single heterojunction bipolar transistors (d-SHBT's) and the InGaP/GaAs/InGaP d-doped double heterojunction bipolar transistors (d-DHBT's) with InGaP passivation layers. Effect of passivation-layer thickness on the performance of the studied devices was investigated. Various passivation-layer thickness (0~100-nm-thick) were employed in the device fabrication to examine the device performance. Experimental findings show that both collector currents and current gains are enhanced at fixed base currents when a 40~60-nm-thick InGaP passivation layer for d-HBT's are used. We obtained a current gain and a collector current of 340 (300), 50 (42) mA at a base current of 200 uA for a d-SHBT with (and without) an InGaP passivation layer and current gain of 350 (280) at a base current of 100 uA for d-DHBT's with (and without) an InGaP one, respectively. And because of using a d-doped sheet to eliminate the potential spike at B-E and C-B heterojunctions, all d-HBT's exhibit extremely small offset voltages about 50 mV and collector current saturation voltages (knee voltages) smaller than 2.5 V. According to these results, InGaP/GaAs d- HBT's with InGaP passivation layers are suitable for high-gain, high-power, and high-frequency applications. Second, We proposed that a new InGaAs-based HBT with an InAlAs/InGaAs multiple-quantum-well (MQW) carrier confinement emitter layer in this study. Large-area (150 um*150 um) MQW- HBT's exhibit a much smaller offset voltage and a similar current gain as compared to a conventional heterostructure- emitter bipolar transistor (HEBT) with a bulk-InAlAs confinement emitter layer. The measured offset voltage and current gain are 75 (300) mV and 26 (21) in average for a MQW- HBT (HEBT). It is attributed the success to the reduction of effective conduction band offset. Furthermore, the DC current gain is nearly area-independent. All devices with large-area and small-area emitters exhibit current gains of 26 +- 3. Lour Wen-Shiung 羅文雄 1998 學位論文 ; thesis 70 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立海洋大學 === 電機工程學系 === 86 === In this thesis, we present two kind layers, passivation and carrier confinement layers of HBT. First, we report on the fabrications and characterizations of the InGaP/GaAs d-doped single heterojunction bipolar transistors (d-SHBT's) and the InGaP/GaAs/InGaP d-doped double heterojunction bipolar transistors (d-DHBT's) with InGaP passivation layers. Effect of passivation-layer thickness on the performance of the studied devices was investigated. Various passivation-layer thickness (0~100-nm-thick) were employed in the device fabrication to examine the device performance. Experimental findings show that both collector currents and current gains are enhanced at fixed base currents when a 40~60-nm-thick InGaP passivation layer for d-HBT's are used. We obtained a current gain and a collector current of 340 (300), 50 (42) mA at a base current of 200 uA for a d-SHBT with (and without) an InGaP passivation layer and current gain of 350 (280) at a base current of 100 uA for d-DHBT's with (and without) an InGaP one, respectively. And because of using a d-doped sheet to eliminate the potential spike at B-E and C-B heterojunctions, all d-HBT's exhibit extremely small offset voltages about 50 mV and collector current saturation voltages (knee voltages) smaller than 2.5 V. According to these results, InGaP/GaAs d- HBT's with InGaP passivation layers are suitable for high-gain, high-power, and high-frequency applications. Second, We proposed that a new InGaAs-based HBT with an InAlAs/InGaAs multiple-quantum-well (MQW) carrier confinement emitter layer in this study. Large-area (150 um*150 um) MQW- HBT's exhibit a much smaller offset voltage and a similar current gain as compared to a conventional heterostructure- emitter bipolar transistor (HEBT) with a bulk-InAlAs confinement emitter layer. The measured offset voltage and current gain are 75 (300) mV and 26 (21) in average for a MQW- HBT (HEBT). It is attributed the success to the reduction of effective conduction band offset. Furthermore, the DC current gain is nearly area-independent. All devices with large-area and small-area emitters exhibit current gains of 26 +- 3.
author2 Lour Wen-Shiung
author_facet Lour Wen-Shiung
Hsieh, Jin-Lung
謝金龍
author Hsieh, Jin-Lung
謝金龍
spellingShingle Hsieh, Jin-Lung
謝金龍
Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers
author_sort Hsieh, Jin-Lung
title Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers
title_short Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers
title_full Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers
title_fullStr Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers
title_full_unstemmed Investigation of The Scaling HBT's Using Carrier Confinement and Passivation Layers
title_sort investigation of the scaling hbt's using carrier confinement and passivation layers
publishDate 1998
url http://ndltd.ncl.edu.tw/handle/70126026537602767254
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