A Study on Outgassing Behavior of Spin-on Glass(SOG) Modified by Ion Implantation

博士 === 國立清華大學 === 材料科學與工程學系 === 86 === The difficulty in the use of spin-on-glass (SOG) for multilevel interconnections leads to the requirement of higher-temperature (800~850℃) curing of the material, since the low-temperature annealed SOG may result in a significant amount of moisture during subse...

Full description

Bibliographic Details
Main Author: 游正弘
Other Authors: 張一熙
Format: Others
Language:en_US
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/37561517921781565002