A Study of Via Formation in Polymide Dielectric
碩士 === 國立交通大學 === 材料科學與工程研究所 === 86 === In this work we studied the via formation in Du Pont PI-2555 Polyimide by employing the wet chemical etching and reactive ion etching (RIE) processes. Experimental results indicated that wet etching was a very fast (etching rate≡0.17∼1.08um/sec), simple,...
Main Authors: | Chuang, Pao-Ti, 莊寶弟 |
---|---|
Other Authors: | Hsieh T. E. |
Format: | Others |
Language: | zh-TW |
Published: |
1998
|
Online Access: | http://ndltd.ncl.edu.tw/handle/99529610413556042079 |
Similar Items
-
Polymides for advanced applications
by: Rich, D. C
Published: (2008) -
A Study of the Physical Properties of Three Dimensional Carbon Fabrics Reinforced Polymide Resin
by: 黃寶益
Published: (1995) -
The synthesis, characterization, and application of ether-containing polymides
by: Fay, Catharine Croall
Published: (1995) -
Star-like polymides based on the fluorine central unit
by: Petzold, Odessa N.
Published: (1996) -
Polymide V-groove joints for three - dimensional silicon transducers
by: Ebefors, Thorbjörn
Published: (2000)