A Study of Via Formation in Polymide Dielectric

碩士 === 國立交通大學 === 材料科學與工程研究所 === 86 ===   In this work we studied the via formation in Du Pont PI-2555 Polyimide by employing the wet chemical etching and reactive ion etching (RIE) processes.   Experimental results indicated that wet etching was a very fast (etching rate≡0.17∼1.08um/sec), simple,...

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Bibliographic Details
Main Authors: Chuang, Pao-Ti, 莊寶弟
Other Authors: Hsieh T. E.
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/99529610413556042079