Reactive sputtering TiAlN films applied as a diffusion barrier between copper and silicon
碩士 === 國立成功大學 === 材料科學(工程)學系 === 86 === (Ti,Al)N films have been grown onto Si(100) by d.c. reativemagnetron sputtering from a titanium-aluminum alloy target atdifferent nitrogen partial pressure. (Ti,Al)N films about100nm thick were used as diffusion bar...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82549230727842166508 |