Modeling TSOP Molding Process to Predict the Amount of Paddle Shift
碩士 === 國立成功大學 === 工程科學系 === 86 === This study is to develop a methodology to simulate the molding process of TSOP*s (Thin Small Outline Packages) and predict the paddle shift caused by pressure difference and viscous stress during molding....
Main Authors: | Su, Ching-Ko, 蘇敬科 |
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Other Authors: | Huei-Huang Lee |
Format: | Others |
Language: | zh-TW |
Published: |
1998
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Online Access: | http://ndltd.ncl.edu.tw/handle/55663332592424752604 |
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