Modeling TSOP Molding Process to Predict the Amount of Paddle Shift

碩士 === 國立成功大學 === 工程科學系 === 86 === This study is to develop a methodology to simulate the molding process of TSOP*s (Thin Small Outline Packages) and predict the paddle shift caused by pressure difference and viscous stress during molding....

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Bibliographic Details
Main Authors: Su, Ching-Ko, 蘇敬科
Other Authors: Huei-Huang Lee
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/55663332592424752604