Modeling TSOP Molding Process to Predict the Amount of Paddle Shift

• Main Authors: Su, Ching-Ko, 蘇敬科
• Other Authors: Huei-Huang Lee
• Format: Others
• Language: zh-TW
• Published: 1998
• Online Access: http://ndltd.ncl.edu.tw/handle/55663332592424752604

碩士 === 國立成功大學 === 工程科學系 === 86 === This study is to develop a methodology to simulate the molding process of TSOP*s (Thin Small Outline Packages) and predict the paddle shift caused by pressure difference and viscous stress during molding. Because the velocity component in thickness direction of an EMC (Epoxy Molding Compound) contributes the loads of die pad, and an IC package has complicated 3D structure, a true 3D CFD (Computational Fluid Dynamics) package is needed to achieve this goal. FIDAP was used in this study. First, a simplified and enlarged transparent mold model was made to carry out a molding experiment. The pictures of flow patterns that have been taken during the experiment were compared to the results from FIDAP simulation in order to make sure the appropriateness of the modeling methodology. Then a true 3D model which has nearly the same dimensions of typical TSOP*s but simplified in leadframe was simulated to obtain the load distribution on die pad during molding process. Finally, the amount of paddle shift was computed by ANSYS.