The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress

The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress

碩士 === 國立成功大學 === 工程科學系 === 86 ===

Bibliographic Details
Main Authors:	Tsao, hui-min, 曹惠旻
Other Authors:	CHEN RONG-SHENG
Format:	Others
Language:	zh-TW
Published:	1998
Online Access:	http://ndltd.ncl.edu.tw/handle/43632260784491018711

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