The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress
碩士 === 國立成功大學 === 工程科學系 === 86 ===
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43632260784491018711 |