The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress

The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress

碩士 === 國立成功大學 === 工程科學系 === 86 ===

Bibliographic Details
Main Authors: Tsao, hui-min, 曹惠旻
Other Authors: CHEN RONG-SHENG
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/43632260784491018711
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spelling ndltd-TW-086NCKU10280232015-10-13T11:03:33Z http://ndltd.ncl.edu.tw/handle/43632260784491018711 The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress 利用田口式品質方法分析Chip/Encapsulant界面間之裂紋對PDIP構裝受熱-脈衝下在黏晶處邊緣應力之影響 Tsao, hui-min 曹惠旻 碩士 國立成功大學 工程科學系 86 CHEN RONG-SHENG 陳榮盛 1998 學位論文 ; thesis 60 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立成功大學 === 工程科學系 === 86 ===
author2 CHEN RONG-SHENG
author_facet CHEN RONG-SHENG
Tsao, hui-min
曹惠旻
author Tsao, hui-min
曹惠旻
spellingShingle Tsao, hui-min
曹惠旻
The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress
author_sort Tsao, hui-min
title The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress
title_short The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress
title_full The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress
title_fullStr The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress
title_full_unstemmed The Application of Taguchi Method Analysis in Chip/Encapsulant Defect and Thermal-Pulsed on PDIP Package Adhesive due to Edge Stress
title_sort application of taguchi method analysis in chip/encapsulant defect and thermal-pulsed on pdip package adhesive due to edge stress
publishDate 1998
url http://ndltd.ncl.edu.tw/handle/43632260784491018711
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