Thermal Strain Measurments in BGA Solder Joints
碩士 === 國立成功大學 === 工程科學系 === 86 === ABSTRACTThis study presents thermal deformation on solder joints during repeated cycledworking period because of the mismatch of CTE among solder joints、overmold andPCB(print circuit board) in PBGA. It leads to fatigue o...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
1998
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Online Access: | http://ndltd.ncl.edu.tw/handle/10754336585837456278 |