Thermal Strain Measurments in BGA Solder Joints

碩士 === 國立成功大學 === 工程科學系 === 86 === ABSTRACTThis study presents thermal deformation on solder joints during repeated cycledworking period because of the mismatch of CTE among solder joints、overmold andPCB(print circuit board) in PBGA. It leads to fatigue o...

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Bibliographic Details
Main Authors: Shih, Li-Wei, 石禮維
Other Authors: Huang Ming-Jer
Format: Others
Language:zh-TW
Published: 1998
Online Access:http://ndltd.ncl.edu.tw/handle/10754336585837456278