The Study of Chemical-Mechanical Polishing Process and Clear
碩士 === 國立中興大學 === 電機工程學系 === 86 === Control of surface roughness during the chemical- mechanical polishing (CMP) process is key to the preparation of smooth, defect-free silicon starting surfaces. In particular, the CMP process is a critical...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/20114890213056319900 |