The Electroplating Of Palladium-Nickel and Gold on Metallic Contact Surface
碩士 === 義守大學 === 材料科學與工程研究所 === 86 === The main objective of this investigation was to testify whether 0.8Pd/0,2Ni alloy electroplating can substitute for the most popular hard gold(or cobalt gold) plating for today's electronic industry. Forst of all a base plating of nickel on a copper alloy...
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| Format: | Others |
| Language: | zh-TW |
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1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14996183211479026016 |