The Development of Computer-Aided Drawing and Design System for IC Lead Frame
碩士 === 中原大學 === 機械工程研究所 === 86 === The lead frame in IC serves primarily to connect the chips as well as the carrier, support the chips, and help position in the packaging process. Accordingto the increasing of I/O counts, the technology of IC encapsulation and lead frame design face more challenges...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1998
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48756120520864473931 |