Flow Visualization of Wire Sweep in IC Packaging
碩士 === 國立臺灣大學 === 機械工程學系 === 85 === Abstract Transfer molding(TM) is the primary process method for IC encapsulation with epoxy molding compound. During filling stage, the epoxy would exert drage force on wires and cause wire sweep. If the adjecant wir...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/01933241701374165006 |