An MCM Layout with EMC Consideration
碩士 === 國立臺灣大學 === 電機工程學系 === 85 === In recent years, interconnection analysis and packaging technology have become the bottleneck to take full advantage of the advances in semiconductor fabrication technology. The Multi- Chip Module (MCM )...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00657915746273984271 |