Kinetics of Thermal and Oxidative Decompositions of Printed Circuit Board

碩士 === 國立中山大學 === 環境工程與科學系 === 85 ===   The kinetics of thermal decomposition of printed circuit board have been investigated thermogravimetrically under various heating rates enther in nitrogen or mixed with 5-15% oxygen in nitrogen. The results show that in pure nitrogen the reaction involves onl...

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Bibliographic Details
Main Authors: Chen, Hsien-Chung, 陳獻忠
Other Authors: Chen, Kang-Shin
Format: Others
Language:zh-TW
Published: 1997
Online Access:http://ndltd.ncl.edu.tw/handle/43284468237498893532