Mo and Cr Based Diffusion Barrier in Cu and Al Metallization
碩士 === 國立交通大學 === 電子工程學系 === 85 === This thesis studies the effect of MoNx and CrNx diffusion barrier on the thermal stability of Cu/barrier/p+n junction diodes. The MoNx and CrNx films were prepared by two technoques: the re...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1997
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52927597874322723188 |