Studies on the Filler of Resin Bonded Diamond for the Performance of Grinding Tungsten Carbide

碩士 === 華梵大學 === 機電工程研究所 === 85 ===   This paper describes experimental results using a resin - bonded diamond wheel with different fillers in the vertial dry grinding of P10 grade tungsten carbide. The conditions of the diamond abrasive cutting edge on the worn wheel surface and the grinding perfor...

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Bibliographic Details
Main Authors: Liu, Yii-Ching, 劉以卿
Other Authors: Luo, Sheng-Yih
Format: Others
Language:zh-TW
Published: 1997
Online Access:http://ndltd.ncl.edu.tw/handle/12226428819770583920