Analysis of a Partially Sealed Absorbing Cavity in a Packaged Microstrip Circuit
碩士 === 國立交通大學 === 電信工程研究所 === 84 === In this thesis we propose and analyze a partially sealed absorbing cavity in a packaged microstrip circuit. This structure is formed by absorbing dielectric layers attached on the top cover of the pack...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1996
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13440904829319324058 |