Chemical-Mechanical Polishing and Material Characterization of Low Dielectric Constant PECVD Fluorinated Oxide Thin Films

碩士 === 國立交通大學 === 材料科學與工程研究所 === 84 === Advanced semiconductor device interconnects are the pivotal component governing the final device yield and reliability. The trend toward shrinking design rules and increased interconnect pack...

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Bibliographic Details
Main Authors: Hsieh, Yuan-Tsu, 謝元智
Other Authors: Feng Ming-Shiann, Dai Bau-Tong
Format: Others
Language:zh-TW
Published: 1996
Online Access:http://ndltd.ncl.edu.tw/handle/52928629850932934772