Thermal stress analysis in the solder joint of the electronic packckage by finite element method
碩士 === 國立清華大學 === 材料科學(工程)研究所 === 83 ===
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1995
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31494831776436618235 |