Effects on device characteristics of CMP planarization process

碩士 === 國立交通大學 === 電子研究所 === 83 === CMP planarization process is more and more important on multilevel structure for resent years. In this thesis, we investigated the effects of CMP on the underlying dielectric films reliability by studing o...

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Bibliographic Details
Main Authors: Jyng-Ping Hwu, 胡鈞屏
Other Authors: Tan-Fu Lei
Format: Others
Language:en_US
Published: 1995
Online Access:http://ndltd.ncl.edu.tw/handle/13172418208941317882