An Inspection System for Detecting Defects on Chip

• Main Authors: Ren-Kewi Yang, 楊仁魁
• Other Authors: Kou-Yuan Huang
• Format: Others
• Language: en_US
• Published: 1995
• Online Access: http://ndltd.ncl.edu.tw/handle/79258641590958327275

碩士 === 國立交通大學 === 資訊科學學系 === 83 === An image inspection system for detecting defects on chip is developed. The system can automatically inspect defects of chips on wafer after operator's alignment.The system consists of three parts: 1. image acquisition, 2. image preprocessing, 3. defect detection. A chip to be inspected has three parts which are bonding pad, active region, and edge region. In bonding pad, the defect is coating.In active region, the defects are abnormal spots and scratches. In edge region, the defects are scratch and crack. These three parts are inspected sequentially for their defects. Good chip must pass all inspections of these three parts. Otherwise, chip is classified into bad chip without the inspection of next part when one part is rejected. Experimental result shows that the recognition rate of good chip can reach 99.21% and the recognition rate of bad chip can reach 90.48%.For inspection time, the average time of inspecting one chip by the system is about 6327.5 ms.