| Summary: | 碩士 === 國立交通大學 === 資訊科學學系 === 83 === An image inspection system for detecting defects on chip is
developed. The system can automatically inspect defects of
chips on wafer after operator's alignment.The system consists
of three parts: 1. image acquisition, 2. image preprocessing,
3. defect detection. A chip to be inspected has three
parts which are bonding pad, active region, and edge region.
In bonding pad, the defect is coating.In active region, the
defects are abnormal spots and scratches. In edge region, the
defects are scratch and crack. These three parts are
inspected sequentially for their defects. Good chip must
pass all inspections of these three parts. Otherwise, chip is
classified into bad chip without the inspection of next part
when one part is rejected. Experimental result shows that the
recognition rate of good chip can reach 99.21% and the
recognition rate of bad chip can reach 90.48%.For inspection
time, the average time of inspecting one chip by the system is
about 6327.5 ms.
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