Thermal Stress Simulations of Solder Joints with Finite Element Methods
碩士 === 國立交通大學 === 電子研究所 === 82 === A general finite element analysis program, MSC/NASTRAN, and a graphical processor are employed to study thermal stresses of solder joints in a beam specimen. Finite element methods are used in this research because the m...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1994
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93207236376174028345 |
| Summary: | 碩士 === 國立交通大學 === 電子研究所 === 82 === A general finite element analysis program, MSC/NASTRAN, and a
graphical processor are employed to study thermal stresses of
solder joints in a beam specimen. Finite element methods are
used in this research because the methods can overcome
difficulties encountered by conventional analytical methods.
The effects of element mesh-size and degrees of freedom per
grid point in the created model are studied. Both isothermal
and nonisothermal loading conditions are simulated and results
are compared. The nonisothermal load is acquired from a
simulation of temperature distribution due to power dissipation
. In addition, the joint-height and joint-area of solder alloy
are studied for their effects on the sensitivity of thermal
imposed strains. Also simulations with the assumptions that
solder alloys behave as elastoplastic alloys and elastic-creep
alloys are performed to study the dynamic response of the beam
specimen subjected to thermal cycles.
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