Thermal Stress Simulations of Solder Joints with Finite Element Methods
碩士 === 國立交通大學 === 電子研究所 === 82 === A general finite element analysis program, MSC/NASTRAN, and a graphical processor are employed to study thermal stresses of solder joints in a beam specimen. Finite element methods are used in this research because the m...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1994
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93207236376174028345 |