Low-Stress Epoxy Encapsulants for Semiconductor Application
博士 === 國立成功大學 === 化學工程研究所 === 82 === Epoxy molding compounds (EMCs) have been widely used as encapsulation material for semiconductor devices. ο-Cresol- formaldehyde novolac epoxy (CNE) is the resin typically employed to encapsulate microelectronic device...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
1994
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75295156547685810899 |