Thermal analysis of electronics packaging by numerical method

Thermal analysis of electronics packaging by numerical method

碩士 === 國立成功大學 === 工程科學研究所 === 80 ===

Bibliographic Details
Main Authors:	ZENG, DE-YU, 曾德玉
Other Authors:	ZHOU, RONG-HUA
Format:	Others
Language:	zh-TW
Published:	1992
Online Access:	http://ndltd.ncl.edu.tw/handle/61526712671924170327

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