Thermal analysis of electronics packaging by numerical method

碩士 === 國立成功大學 === 工程科學研究所 === 80 ===

Bibliographic Details
Main Authors: ZENG, DE-YU, 曾德玉
Other Authors: ZHOU, RONG-HUA
Format: Others
Language:zh-TW
Published: 1992
Online Access:http://ndltd.ncl.edu.tw/handle/61526712671924170327