Application of thermal CAD/CAE system on the modern electronics packaging design

碩士 === 國立清華大學 === 動力機械研究所 === 78 ===

Bibliographic Details
Main Authors: LIN,QING-DE, 林慶德
Other Authors: HONG,YING-HUI
Format: Others
Language:zh-TW
Published: 1990
Online Access:http://ndltd.ncl.edu.tw/handle/34674475961803943033