Transient and Steady-state Creep in a SnAgCu Lead-free Solder Alloy: Experiments and Modeling
It has been conventional to simplify the thermo-mechanical modeling of solder joints by omitting the primary (transient) contributions to total creep deformation, assuming that secondary (steady-state) creep strain is dominant and primary creep is negligible. The error associated with this assumptio...
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| Language: | en_ca |
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2009
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| Online Access: | http://hdl.handle.net/1807/26476 |