Low Percolation Threshold in Electrically Conductive Adhesives using Complex Dimensional Fillers

Bibliographic Details
Main Author: Taubert, Clinton J.
Language:English
Published: University of Akron / OhioLINK 2018
Subjects:
Online Access:http://rave.ohiolink.edu/etdc/view?acc_num=akron1542727822099192